# Cadence Design Systems, Inc.  Share Price Target ‘$325.12’, now 26.9% Upside Potential

- Link: https://www.directorstalkinterviews.com/cadence-design-systems-inc.share-price-target-325.12-now-26.9-upside-potential/4121170216
- Published: 2024-09-04T14:37:11+01:00
- Author: Charlotte Edwards

**Cadence Design Systems, Inc.** which can be found using ticker (CDNS) now have
13 market analysts covering the stock. The analyst consensus now points to a rating
of ‘buy’. The target price High/Low ranges between $355.00 and $257.52 calculating
the average target share price we see $325.12. (at the time of writing). Given that
the stocks previous close was at $256.28 this would imply there is now a potential
upside of 26.9%. It’s also worth noting that there is a 50 day moving average of
$283.29 and the 200 moving average now moves to $288.44. The market cap for the 
company is 68.45B. The price for the stock stands currently at: $250.00 USD

 The potential market cap would be $86,842,863,099 based on the market consensus.

The company is not paying dividends at this time.

Other points of data to note are a P/E ratio of 64.6, revenue per share of $15.43
and a 12.15% return on assets.

Cadence Design Systems, Inc. is an electronic system designing company. The Company’s
Custom IC Design and Simulation offerings are used by its customers to create schematic
and physical representations of circuits down to the transistor level for analog,
mixed-signal, custom digital, memory and radio frequency (RF) designs. Its Digital
IC Design and Signoff solutions are used to create logical representations of a 
digital circuit or an integrated circuit (IC) that can be verified for correctness
prior to implementation. The Company’s Functional Verification products are used
by its customers to verify that the circuitry or the software they have designed
is consistent with the functional specification. Its IP offerings consist of pre-
verified, customizable functional blocks. Its System Design and Analysis offerings
are used by its customers to develop printed circuit boards (PCBs) and advanced 
IC packages and to analyze electromagnetic, electro-thermal and other multi-physics
effects.

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