# Cadence Design Systems, Inc. – Consensus ‘buy’ rating and 18.8% Upside Potential

- Link: https://www.directorstalkinterviews.com/cadence-design-systems-inc.consensus-buy-rating-and-18.8-upside-potential/4121165661
- Published: 2024-07-22T13:17:04+01:00
- Author: Charlotte Edwards

**Cadence Design Systems, Inc.** which can be found using ticker (CDNS) have now
13 confirmed analysts covering the stock with the consensus suggesting a rating 
of ‘buy’. The range between the high target price and low target price is between
$355.00 and $280.00 suggesting an average Analsyt target price of $330.20. Given
that the stocks previous close was at $277.83 this would imply there is now a potential
upside of 18.8%. The day 50 moving average is $302.82 while the 200 day moving average
is $287.21. The company has a market capitalization of 76.26B. The current share
price for the company is: $279.95 USD

 The potential market cap would be $90,640,482,164 based on the market consensus.

The company is not paying dividends at this time.

Other points of data to note are a P/E ratio of 72.9, revenue per share of $15.14
and a 13.86% return on assets.

Cadence Design Systems, Inc. is an electronic system designing company. The Company’s
Custom IC Design and Simulation offerings are used by its customers to create schematic
and physical representations of circuits down to the transistor level for analog,
mixed-signal, custom digital, memory and radio frequency (RF) designs. Its Digital
IC Design and Signoff solutions are used to create logical representations of a 
digital circuit or an integrated circuit (IC) that can be verified for correctness
prior to implementation. The Company’s Functional Verification products are used
by its customers to verify that the circuitry or the software they have designed
is consistent with the functional specification. Its IP offerings consist of pre-
verified, customizable functional blocks. Its System Design and Analysis offerings
are used by its customers to develop printed circuit boards (PCBs) and advanced 
IC packages and to analyze electromagnetic, electro-thermal and other multi-physics
effects.

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